Hermetic sealing of optical device and hybrid IC
Joining method： Seam welding
Features of the joining method
- It can be applied to hermetic sealing of packages with various shapes and sizes.
- Vacuum sealing, in addition to N2 sealing, can be made.
- As the seam welding length, the welding speed and the welding interval time can be freely combined, thorough countermeasures against heat impact can be implemented.
Applicable to various package types
- PKG：Package
- Pin grid array（Large sized ceramic PKG）
- Hybrid IC（Large sized metal PKG）
- Optical device（PKG with glass window）
- Device for optical communication（Metal PKG）
- Custom LSI（Round shaped seam PKG）
Micro-joining application: Seam welding of optical device and hybrid IC
Metal lid is placed on ceramic package or metal package, and hermetic sealing is achieved by seam welding.
Related video
Playback time: Approx. 1'4"
- Please be careful for the volume adjustment as this movie contains sound.
Applicable machine models
Sample test
We will be pleased to test your sample with our proposed joining method, and return it with a report.
- Click the "Contact Us" button on the right.
(for dealer information, sample test or technical consultation)
