Hermetic sealing of optical device and hybrid IC
Joining method: Seam welding
Features of the joining method
- It can be applied to hermetic sealing of packages with various shapes and sizes.
- Vacuum sealing, in addition to N2 sealing, can be made.
- As the parallel seam welding length, the welding speed and the welding interval time can be freely combined, thorough countermeasures against heat impact can be implemented.
Applicable to various package types
- PKG:Package
- Pin grid array(Large sized ceramic PKG)
- Hybrid IC(Large sized metal PKG)
- Optical device(PKG with glass window)
- Device for optical communication(Metal PKG)
- Custom LSI(Round shaped seam PKG)
Micro-joining application: parallel seam welding of optical device and hybrid IC
Metal lid is placed on ceramic package or metal package, and hermetic sealing is achieved by seam welding.
Related video
- Please be careful for the volume adjustment as this movie contains sound.
Applicable machine models
- Parallel Seam Sealer:In N2 gas Type/semi- Automatic Type
- Parallel Seam Sealer:In Vacuum Type/semi- Automatic Type
Sample test
We will be pleased to test your sample with our proposed joining method, and return it with a report.
- Click the "Contact Us" button on the right.
(for dealer information, sample test or technical consultation)