Hermetic sealing of optical device and hybrid IC
Joining method： Seam welding
Features of the joining method
- It can be applied to hermetic sealing of packages with various shapes and sizes.
- Vacuum sealing, in addition to N2 sealing, can be made.
- As the parallel seam welding length, the welding speed and the welding interval time can be freely combined, thorough countermeasures against heat impact can be implemented.
Applicable to various package types
- PKG：Package
- Pin grid array（Large sized ceramic PKG）
- Hybrid IC（Large sized metal PKG）
- Optical device（PKG with glass window）
- Device for optical communication（Metal PKG）
- Custom LSI（Round shaped seam PKG）
Micro-joining application: parallel seam welding of optical device and hybrid IC
Metal lid is placed on ceramic package or metal package, and hermetic sealing is achieved by seam welding.
Related video
- Please be careful for the volume adjustment as this movie contains sound.
Applicable machine models
- Parallel Seam Sealer：In N2 gas Type/semi- Automatic Type
- Parallel Seam Sealer：In Vacuum Type/semi- Automatic Type
Sample test
We will be pleased to test your sample with our proposed joining method, and return it with a report.
- Click the "Contact Us" button on the right.
(for dealer information, sample test or technical consultation)
