Hermetic sealing of optical device and hybrid IC

Joining method: Seam welding

Features of the joining method

Applicable to various package types

Photo:PKG:Package
PKG:Package
  1. Pin grid array(Large sized ceramic PKG)
  2. Hybrid IC(Large sized metal PKG)
  3. Optical device(PKG with glass window)
  4. Device for optical communication(Metal PKG)
  5. Custom LSI(Round shaped seam PKG)

Micro-joining application: parallel seam welding of optical device and hybrid IC

Metal lid is placed on ceramic package or metal package, and hermetic sealing is achieved by seam welding.

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Related video

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Applicable machine models

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Sample test

We will be pleased to test your sample with our proposed joining method, and return it with a report.

Click the "Contact Us" button on the right.
(for dealer information, sample test or technical consultation)

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Micro Joining Equipment
Infrared Thermal Imaging Camera
Radiation Hardened POL DC/DC CONVERTER