Laser soldering

Joining method: Laser joining

Feature of the joining method

Chip resistor
Photo:Chip resistor
FPC
Photo:FPC
Coil
Photo:Coil
Photo:DIP component
DIP component
Photo:Solder bumps
Solder bumps
Photo:Insulated wire
Insulated wire

Micro-joining application: Soldering by laser

SMT components, DIP components and insulated wires can be soldered without contact onto PWB patterns or terminals.

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Related video

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Applicable machine models

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Sample test

We will be pleased to test your sample with our proposed joining method, and return it with a report.

Click the "Contact Us" button on the right.
(for dealer information, sample test or technical consultation)

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Micro Joining Equipment
Infrared Thermal Imaging Camera
Radiation Hardened POL DC/DC CONVERTER