ACF (Glass + FPC) Thermal Compression Bonding

ACF (Glass + FPC) Thermal Compression Bonding

Because pulse heat method can prevent lowering of temperature due to radiation by its temperature feedback function, it can thermoset the ACF more efficiently comparing to the constant heating type. Pulse heat method, where temperature can be controlled, is effective in the pre- bonding process in particular.
Furthermore, because the thermosetting process comes after the force application process, misalignment of ACF or non-connection of conductive particles can be prevented.

ACF (Glass + FPC) Thermal Compression Bonding

Joining MethodHot Bar Reflow Soldering / Pulse Heat
Processing MethodThermo-compression Joining
End ProductsFPD
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