LCD module assembly
Joining method：soldering, thermo-compression joining
- Features of pulse heat joining (hot bar bonding)
- Related video
- Applicable machine models
- Sample test
Features of pulse heat joining (hot bar bonding)
When soldering or thermo-compression joining of flexible circuits, such as the TAB or the FPC, highly reliable joining can be realized without lifting up or misalignment by employing the pulse heat method where heating and cooling are conducted with the pressure being applied.
- The entire LCD module
- Enlarged view of section A
Joining(1) Joining of TAB on LCD panel
Connection of LCD（ITO pattern) and the TAB is realized by pulse heat method via a tape material called ACF (Anisotropic Conductive Film) which contains conductive particles. High pressure and uniform pressure and temperature distribution are realized by the pulse heat method.
Joining(2) Joining of TAB and PWB (driver circuit)
TAB and PWB are connected by pulse heating via solder. Normally, solder is previously applied on the PWB side pattern.
Joining(3) Joining of PWB (driver circuit) and mother board
FFC (Flexible Flat Cable) is used for connection of LCD module and the main board (mother board).
Similar to the case of Joining(2), solder is previously applied on the PWB side pattern prior to the pulse heat connection.
Related video
- Please be careful for the volume adjustment as this movie contains sound.
Applicable machine models
- General Purpose Type Pulse Heat Power Supply TCW-315
- High Power Type Pulse Heat Power Supply PHU-35
- Pulse Heat System Head NA-11 series, NA-15 series
- Pulse Heat Bonder TCW-125
Sample test
We will be pleased to test your sample with our proposed joining method, and return it with a report.
- Click the "Contact Us" button on the right.
(for dealer information, sample test or technical consultation)
