LCD module assembly

Joining method:soldering, thermo-compression joining

Features of pulse heat joining (hot bar bonding)

When soldering or thermo-compression joining of flexible circuits, such as the TAB or the FPC, highly reliable joining can be realized without lifting up or misalignment by employing the pulse heat method where heating and cooling are conducted with the pressure being applied.

The entire LCD module
Image:The entire LCD module
Enlarged view of section A
Image:Enlarged view of section A

Joining(1) Joining of TAB on LCD panel

Connection of LCD(ITO pattern) and the TAB is realized by pulse heat method via a tape material called ACF (Anisotropic Conductive Film) which contains conductive particles. High pressure and uniform pressure and temperature distribution are realized by the pulse heat method.

Joining(2) Joining of TAB and PWB (driver circuit)

TAB and PWB are connected by pulse heating via solder. Normally, solder is previously applied on the PWB side pattern.

Joining(3) Joining of PWB (driver circuit) and mother board

FFC (Flexible Flat Cable) is used for connection of LCD module and the main board (mother board).
Similar to the case of Joining(2), solder is previously applied on the PWB side pattern prior to the pulse heat connection.

To Top of Page

Related video

To Top of Page

Applicable machine models

To Top of Page

Sample test

We will be pleased to test your sample with our proposed joining method, and return it with a report.

Click the "Contact Us" button on the right.
(for dealer information, sample test or technical consultation)

To Top of Page

Micro Joining Equipment

Product Search

Products
Micro Joining Equipment
Infrared Thermal Imaging Camera
Radiation Hardened POL DC/DC CONVERTER
Support
Micro Joining Equipment
Infrared Thermal Imaging Camera
Intelligent Projector
Company Profile
Company's Outline
History
Offices
News Releases
Contact Us
Micro Joining Equipment
Infrared Thermal Imaging Camera
Radiation Hardened POL DC/DC CONVERTER