Soldering quality of a fine pitch FPC connector is desired to be improved
Pulse heat realizes high quality soldering by displacement control
Challenge: Frequency of solder bridge increases due to narrow pitch
FPC/connector Au-rich reduces joining strength.
Background
- Due to increasing communication volume, output volume of optical communication devices have increased, by which FPC connectors have been adapted. Soldering of narrow-pitch. connectors tend to cause bridging, resulting in poor yield.
- When the amount of Au in the solder increases and becomes the Au-rich state, metal compound of Au and Sn increases and becomes brittle, and joining strength decreases. When a large amount of Au is dissolved in the solder, it deteriorates the fluidity of the solder and causes voids.
Avio's Solution: Displacement and temperature controlled pulse heat unit
eliminates soldering problems.
Soldering is always performed with optimum heating time,regardless of variations in the amount of solder.
Point
1. Displacement control
- Thickness of solder is constantly maintained by controlling displacement.
- Bridging is suppressed even with a large amount of solder.
2. Detection of melting solder
- By detecting solder melting, soldering is performed in the shortest time, which minimizes Au penetration into the solder.
Applicable models
Related products
- Sample Test
We will be pleased to test your sample with our proposed
joining method, and return it with a report.
- Click the "Contact Us" button on the right.
(for dealer information, sample test or technical consultation)
