Micro Joining Principles
Nippon Avionics is promoting businesses utilizing six unique micro joining technologies.
- Resistance welding technology for joining metal to metal
- Pulse heating (hot bar bonding) technology for soldering electronic components
- Seam sealing technology for welding a lid onto a case containing electronic components
- Laser joining technology, applicable to a wide range of usages, including metal welding, soldering and plastic welding
- Ultrasonic equipment for resin welding, resin melt cutting, resin cutting, metal joining and food cutting
- High-frequency induction heater unit for non-contact heating of metal using electromagnetic induction
You can view a motion picture explaining the principles of joining from below.
Principle of Pulse Heat Unit (Hot Bar Bonder)
Pulse heat unit is intended to solder electric components. Soldering is also called reflow soldering.
Principle of Laser Welder
Laser welder is intended to solder, and weld plastic using the laser beam.
Principle of Ultrasonic Welding
Ultrasonic equipment for resin welding, resin melt cutting, resin cutting, metal joining and food cutting
Principle of Ultrasonic Metal Welding
Ultrasonic metal welding uses ultrasonic vibration energy to join non-ferrous metals such as aluminum and copper.
Principle of High-frequency Induction Heater Unit
High-frequency induction heater unit for non-contact heating of metal using electromagnetic induction
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