Laser soldering
Joining method： Laser joining
Feature of the joining method
- Accurate and efficient work can be conducted by feeding the solder wire from a solder feeder.
- Soldering to small and narrow area or to high heat dissipation components, where soldering using a soldering iron is difficult, can be achieved.
- If dual pulse type is used, two laser spots are emitted from one laser head enabling simultaneous soldering on two points.
- Chip resistor
- FPC
- Coil
- DIP component
- Solder bumps
- Insulated wire
Micro-joining application: Soldering by laser
SMT components, DIP components and insulated wires can be soldered without contact onto PWB patterns or terminals.
Related video
- Please be careful for the volume adjustment as this movie contains sound.
Applicable machine models
Sample test
We will be pleased to test your sample with our proposed joining method, and return it with a report.
- Click the "Contact Us" button on the right.
(for dealer information, sample test or technical consultation)
