Laser soldering

Joining method: Laser joining

Feature of the joining method

  • Accurate and efficient work can be conducted by feeding the solder wire from a solder feeder.
  • Soldering to small and narrow area or to high heat dissipation components, where soldering using a soldering iron is difficult, can be achieved.
  • If dual pulse type is used, two laser spots are emitted from one laser head enabling simultaneous soldering on two points.
Chip resistor
Photo:Chip resistor
Photo:DIP component
DIP component
Photo:Solder bumps
Solder bumps
Photo:Insulated wire
Insulated wire

Micro-joining application: Soldering by laser

SMT components, DIP components and insulated wires can be soldered without contact onto PWB patterns or terminals.

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Related video

  • Please be careful for the volume adjustment as this movie contains sound.

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Applicable machine models

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Sample test

We will be pleased to test your sample with our proposed joining method, and return it with a report.

Click the "Contact Us" button on the right.
(for dealer information, sample test or technical consultation)

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Micro Joining Equipment

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