Avio Electtronic Devices
High performance back board
 

Example

Features

  • Large size product of 510*720mm can be accommodated
  • High precision hole diameter is suitable for press fit mounting
  • Thickness Cu plating of 40µm can be made inside through holes
  • Characteristic impedance is controlled within 50±10%
  • Low dielectric material of er: 3.6 is used

Characteristics of low dielectiric material(Cvanate Ester)

Material Dielectric Constant
(1MHz) 		Dissipation Factor
(1MHz) 		Tg(°C)
(DMA)
PPE
3.6
0.002
205
CE
3.8
0.009
250

High precision/high strength through hole

Photo: Horizontal profile of pin inserted section

photo Expanded view of contact section
Expanded view of contact section

Product specifications example (press fit type)

No Board thickness (mm) Cu plating thickness (µm) Hole diameter (mm) Drill diameter tolerance (µm) Finish diameter tolerance (µm)
1 2.4 40Min 0.92 +20/-20 +50/-30
2 2.8 20Min 25Ave 0.75 +20/-20 +40/-30
3 4.0 40Min 0.92 +0/-20 +30/-30
4 5.5 20Min 25Ave 0.65 +20/-20 +50/-30


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Specifications and external appearance of the product on this page may be changed for improvement without notice.

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