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Compatible to the latest
ultra-fine pitch CSP/BGA/LGA
- Ball pitch : 0.65, 0.5mm pitch
- Number of balls : 300 pin class
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Compatible to ultra-high
pin count LSI
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Products are offered
in short turn-around-time and
at low price
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High fineness technology
with high reliability
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The latest VLSI, System-LSI, Microcomputer,
ASIC |
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CSP/BGA 0.65 pitch compatible
BTB specifications
| Item |
Specifications |
| Device to be tested |
SystemLSI,etc |
| BT method |
Dynamic |
| Ball pitch |
0.65 |
| Number of balls |
304 |
| Number of sockets
mounted |
26 |
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PWB specifications (unit: mm)
| Item |
Specifications |
| Product Size |
165*580 |
| Number of Layers |
6 |
| Material |
BT resin |
| Minimum clearance |
0.14 |
| Minimum drill diameter/Finish
diameter |
ø0.3/ø0.2 or more |
| Minimum conductor width
(outer layer) |
0.15 |
| Minimum conductor width
(inner layer) |
0.07 |
| Minimum conductor spacing
(outer layer) |
0.15 |
| Minimum conductor spacing
(inner layer) |
0.1 |
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Ultra-high pin count LSI of 2000 pin class.
BTB specifications
| Item |
Specifications |
| Device to be tested |
VLSI,etc |
| BT method |
Dynamic |
| Ball pitch |
1.0 |
| Number of balls |
2000 |
| Number of sockets mounted |
4 |
PWB specifications (unit: mm)
| Item |
Specifications |
| Product Size |
95*255 |
| Number of layers |
6 |
| Material |
Modifined polyimide |
| Minimum clearance |
0.22 |
| Minimum drill diameter/finish
diameter |
ø0.45/ø0.35 or more |
| Minimum conductor width
(outer layer) |
0.15 |
| Minimum conductor width
(inner layer) |
0.1 |
| Minimum conductor spacing
(outer layer) |
0.15 |
| Minimum conductor spacing
(inner layer) |
0.1 |
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Inquiry
Specifications and external appearance
of the product on this page may be changed for improvement without notice.
Copyright © Nippon Avionics Co.,Ltd. All Rights Reserved.
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