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This is a burn-in-test board for mounting fine pitch IC socket
of 0.5mm straight pitch.
Large size of up to 650mm work board size, which is at the top class in the industry, is realized.
Delivery turn-around-time is shortened based on the complete production capability including
fabrication of printed wiring board, assembly and test.
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- Large work board size
up to 500*650mm is available!
- BT resin with high temperature resistivity is employed for the material.
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- Volume production type
devices (memories, microcomputer, etc.)
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No |
Item |
Unit |
Spec |
1 |
Work size |
mm |
500*650 |
2 |
External dimensions |
mm |
440*630 |
3 |
Board thickness |
mm |
1.6 |
4 |
Layer count |
- |
8 |
5 |
Material |
- |
BT resin |
6 |
Through hole drilled diameter |
¢m |
0.25 |
| Minimum finished diameter |
¢m |
0.20 |
| Land diameter |
¢m |
0.43 |
7 |
Inner layer clearance |
µm |
100 |
8 |
Standard conductor line width |
µm |
200 |
9 |
Minimum conductor spacing |
µm |
70 |
10 |
Surface finish |
- |
Pre-flux
Electrolytic Ni / Au |
"High accuracy and high reliability printed wiring boards"
are used.
1 line in 0.5mm spacing is realized by establishment of high accuracy
registration technology !
Through hole cross section |
Through hole cross section (enlargement) |
The board has passed various reliability tests evidencing high
durability.
- Placed in high temperature of 125°C for 2,000Hr equivalent.
(one
time solder float test in 288°C for 10sec. as pre-process)
- Three times solder float test in 288°C for 10sec.
- Thermal shock, -65°C «–» +125°C. 100 cycles.
- Humidity resistance. 25°C–65°C, 80–98%, 160Hr, applying 30V.
(Insulation
resistance measurement. 250V, 60 sec.)
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Inquiry
Specifications and external appearance
of the product on this page may be changed for improvement without notice.
Copyright © Nippon Avionics Co.,Ltd. All Rights Reserved.
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