Avio Electtronic Devices
High precision testing board

Application

  • Final test board
  • Probe card
  • Wafer level burn-in test board
  • Large size interface board for measuring equipment
  

Features

  • High aspect ratio (A/R20) through holes can be created
  • Fine pitch lines of line/space=80/80µm is used
  • Board thickness tolerance, warping and twisting are improved considerably
  • Vacuum contact is accommodated by resin filled through holes
  • Characteristic impedance is controlled within ±5-10%
  • Surface distortion under high temperature is controlled by use of metal core (aluminum, copper, CIC) (See chart below)
  

Distortion characteristics of metal core PWB

Distortion characteristics of metal core PWB

Resin filled through hole

Purpose
  • Prevention of heat dissipation
  • Vacuum contact

Material characteristics

  • Resin: combination of modified acrylic and epoxy
  • Glass transition temperature 143°C(TMA method)
  • Thermal expansion coefficient: 42ppm (a1)
  • Dielectric constant: 4.1

Hole diameter:0.4mm

Charactefistic impedance control

Z0 control is achieved by 4 types of structure
1. micro strip
2. strip
3. dual strip
4. embedded micro strip

 
Electrical characteristic of dual strip line
Electrical characteristic of dual strip line

Inquiry

Specifications and external appearance of the product on this page may be changed for improvement without notice.

Copyright © Nippon Avionics Co.,Ltd. All Rights Reserved.

NIPPON AVIONICS CO.,LTD
PRODUCTS HOME